Assembly Processes, Packaging and Assembly, Packaging Design, Plastic Packaging for Space

A Bonding Relationship – K&S IConn ProCu PLUS & Alter Technology UK

Posted by doEEEt Media Group
On July 28, 2021
0

Offering end-to-end backend semiconductor manufacturing, from wafer singulation to assembled product, the company’s design and process IP enables customers to reduce development and manufacturing costs plus reduce time to market.

Packaging and Assembly, Packaging Design

Package Design and Modelling

Posted by doEEEt Media Group
On March 16, 2020
0

Alter Technology UK, mechanical design experience covers custom hermetic packages, precision optical benches, heat spreaders, sub-mounts, high power laser coupling.

Packaging and Assembly, Packaging Design

Optical design

Posted by doEEEt Media Group
On March 16, 2020
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Alter Technology UK, optical design capabilities are rooted within the laser and photonics industries for EEE components

Alter Technology Products, Packaging Design

FRONT PANEL TL-FP-3421

Posted by doEEEt Media Group
On March 12, 2020
0

ALTER TL-FP3421 provides an efficient way to control and monitor the current status of a 19” Galileo COTS-based system with three LEDs, and one more LED indicates if the system is power supplied or not.

Alter Technology Products, Packaging Design

REMOTE: External Cavity Diode Laser

Posted by doEEEt Media Group
On March 12, 2020
0

For Quantum Technologies to fulfil their potential requires orders of magnitude reduction in size, weight, power-consumption and cost (SWaP-C) compared to many of the current generation of laboratory demonstrators. In addition, the instrument must be reliable in real-world environments where it will be exposed to vibrations, shocks and temperature changes during operation.

Alter Technology Products, Packaging Design

FLAME: Frequency Stabilised Laser

Posted by doEEEt Media Group
On March 12, 2020
0

FLAME is a compact, frequency-stabilised laser module with integrated vapour cell that allows locking to spectral features of an atomic reference. This first FLAME product addresses transitions of Rubidium around 780 nm that are key to applications in Quantum Technologies.