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Packaging and Assembly, Packaging Applications

Flip Chip

  • Posted by doEEEt Media Group
  • On November 12, 2020
  • 0
Flip chip (also known as direct chip attach) is the process whereby a semiconductor die is attached bond pad side down to a substrate or carrier. The electrical connection is made by means of a conductive bump on the die bond pad.
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Packaging and Assembly, Packaging Applications

MEMS Packaging

  • Posted by doEEEt Media Group
  • On March 12, 2020
  • 0
Alter Technology UK, has experience in the assembly and packaging of MEMS devices. Our Labs offers customers support in both prototype/process development for LED packaging
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Packaging and Assembly, Packaging Applications

Laser Diode Packaging

  • Posted by doEEEt Media Group
  • On March 12, 2020
  • 0
Alter Technology UK, offers customers support in both prototype/process development for laser diode packaging as well as volume manufacturing capability.
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Packaging and Assembly, Packaging Applications

Image Sensor Assembly

  • Posted by doEEEt Media Group
  • On March 12, 2020
  • 0
Alter Technology (formerly Optocap), Image Sensor assembly platform is a flexible solution for CMOS, CCD and Focal Plane Array sensor chips into ceramic packages.
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Packaging Applications

LED CHIP On Board

  • Posted by doEEEt Media Group
  • On March 12, 2020
  • 0
Why LED Chip-on-Board? Cost-effective alternative to incandescent and fluorescent light sources Increased life span and efficiency System integration, no user-serviceable parts The reduced total cost of ownership Customised array size and shape Application-specific wavelengths
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Packaging and Assembly, Packaging Applications

System In Package

  • Posted by doEEEt Media Group
  • On March 12, 2020
  • 0
The semiconductor industry requires higher levels of integration, lower costs and greater functionality to meet the demands of consumer and industrial products.
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Packaging and Assembly, Packaging Applications

Chip on Board

  • Posted by doEEEt Media Group
  • On March 12, 2020
  • 0
Chip on Board assembly is the process whereby a bare semiconductor die is mounted on a printed circuit board or substrate using conductive or non-conductive epoxies.
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Packaging and Assembly, Packaging Applications

QUANTUM

  • Posted by doEEEt Media Group
  • On March 12, 2020
  • 0
Quantum technology applications such as atomic clocks, magnetometers and gravitometers are now emerging from the laboratory and confronting the challenging size, weight, power, cost and reliability demands of the real-world.
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Packaging and Assembly, Packaging Applications

Photonic Integrated Circuit (PIC) Packaging

  • Posted by doEEEt Media Group
  • On March 11, 2020
  • 0
A PIC is a photonic integrated circuit that integrates multiple photonic functions, such as lasers, detectors, modulators and splitters on a single chip.
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