Flip chip (also known as direct chip attach) is the process whereby a semiconduc...
Services & Capabilities
A Bonding Relationship – K&S IConn ProCu PLUS & Alter Technology UK
doEEEt Media Group
Offering end-to-end backend semiconductor manufacturing, from wafer singulation...
Europe´s first plastic package line for space applications
doEEEt Media Group
As the demand and use of non-hermetic and plastic-encapsulated microcircuits for...
Space and HI-REL Assembly
doEEEt Media Group
Alter Technology (formerly Optocap), is a leader in the design, manufacture and...
MEMS Packaging
doEEEt Media Group
Alter Technology (formerly Optocap), has experience in the assembly and packagin...
RF and Microwave
doEEEt Media Group
As RF modules run at very high frequencies the effects of capacitance and stray...
Photonic Packaging
doEEEt Media Group
Optoelectronic or Photonics packaging requires extremely accurate placement of c...
Laser Diode Packaging
doEEEt Media Group
Alter Technology (formerly Optocap), offers customers support in both prototype/...
Fast-turn IC Assembly
doEEEt Media Group
Alter Technology (formerly Optocap), also offer fast-turn IC assembly services i...
Image Sensor Assembly
doEEEt Media Group
Alter Technology (formerly Optocap), Image Sensor assembly platform is a flexibl...
LED CHIP On Board
doEEEt Media Group
Why LED Chip-on-Board? Cost-effective alternative to incandescent and fluores...
System In Package
doEEEt Media Group
The semiconductor industry requires higher levels of integration, lower costs an...
Chip on Board
doEEEt Media Group
Chip on Board assembly is the process whereby a bare semiconductor die is mounte...
Photonic Integrated Circuit (PIC) Packaging
doEEEt Media Group
A PIC is a photonic integrated circuit that integrates multiple photonic functio...