APPLICATIONS

for Electronic Components

Services & Capabilities

Flip Chip

doEEEt Media Group
FLIP-CHIP
Flip chip (also known as direct chip attach) is the process whereby a semiconduc...

MEMS Packaging

doEEEt Media Group
MEMS
Alter Technology (formerly Optocap), has experience in the assembly and packagin...

Chip on Board

doEEEt Media Group
LED-array
Chip on Board assembly is the process whereby a bare semiconductor die is mounte...

QUANTUM

doEEEt Media Group
Quantum-
Quantum technology applications such as atomic clocks, magnetometers and gravito...
doEEEt.com