Alter Technology UK, has the capability to pick and place die from a variety of presentation formats with placement accuracies ranging from 1um to 15um.
Wafer Sawing is the process of singulating the wafer into individual dies ready for subsequent assembly.
Alter Technology UK has the capability for Wafer saw of substrates up to 8” diameter. When dicing of substrates of 12” diameter is required then ATN UK can process 12” substrates into smaller segments prior to dicing.
Alter Technology UK, has extensive experience in aligning and attaching fibers and optical components to a wide range of optoelectronic devices, including DFB lasers, Quantum Cascade lasers, SLEDs, SOA and Receivers.
Alter Technology (formerly Optocap), is a leader in the design, manufacture and test of High Reliability Micro and Optoelectronics modules for Harsh Environments. We have experience in a number of high reliability and harsh environment markets such as Aerospace & Defence, Space, Oil & Gas
Alter Technology UK, has experience in the assembly and packaging of MEMS devices.
Our Labs offers customers support in both prototype/process development for LED packaging
As RF modules run at very high frequencies the effects of capacitance and stray inductance become even more important. The RF module must be designed and assembled with an understanding of these effects.
Optoelectronic or Photonics packaging requires extremely accurate placement of components to ensure appropriate suitable alignment and coupling of light into and out of devices.
Alter Technology UK, offers customers support in both prototype/process development for laser diode packaging as well as volume manufacturing capability.
Alter Technology (formerly Optocap), also offer fast-turn IC assembly services into a wide range of ceramic and open-cavity plastic packages including;
CERDIP, CERQUAD, CLCC, CDIP, PGA, TO-Header
QFN, SOIC, QFP, TSOP, SOP, PLCC, PDIP, BGA
Alter Technology (formerly Optocap), Image Sensor assembly platform is a flexible solution for CMOS, CCD and Focal Plane Array sensor chips into ceramic packages.