1981 results found for JEDEC STANDARD
Reference
Title
Source
Type / Subtype
Date
Issue / Rev
Status
Qualify leadframe second source supplier KangQiang (Ningbo), and the base material C19210 (KFC). The purpose of the change is for DPAK‐ Jedec 3L...
Alert Documents
C /
Active
Qualify leadframe as second source supplier and the base material C19210 (KFC). Current leadframe base material C14415 is in short supply on the market and lead time...
Alert Documents
C /
Active
Latchup shall be performed in accordance with JEDEC JESD78. JEDEC JESD78 supersedes JEDEC -STD-17.
DLA
Method
2 /
Active
DLA
Detail / Drawing
01/09/1984 / -
Active
DLA
Generic
A / -
Active
The purpose of this test is to verify that the amount of Lead (Pb) in Tin-Lead (Sn-Pb) alloys and electroplated finishes contain at least 3 weight percent (wt%) Lead...
DLA
Method
/
Active
The changes made to the 5962-17212 are: Pin C4 description; SER and SEP; I2C and ADC; PIN M2 typo correction
Alert Documents
/
Active
This method establishes screening, qualification, and quality conformance requirements for the testing of complex monolithic microcircuits to assist in achieving the...
DLA
Method
4 /
Active
The purpose of this test is to measure bond strengths, evaluate bond strength distributions, or determine compliance with specified bond strength requirements of the...
DLA
Method
10 /
Active
This method establishes qualification and quality conformance inspection procedures for microelectronics to assure that the device and lot quality conforms with the...
DLA
Method
17 /
Active