MIL-STD-883, Method 2037 Mechanical Test Method Standard for Microcircuits: X-Ray Fluorescence (XRF) Scan for Tin (Sn)-Lead (Pb) Content Analysis
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The purpose of this test is to verify that the amount of Lead (Pb) in Tin-Lead (Sn-Pb) alloys and electroplated finishes contain at least 3 weight percent (wt%) Lead by using X-Ray Fluorescence (XRF). This test method also establishes the XRF scan locations, and sampling plans for various package styles
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16/09/2019 0:00:00
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MIL-STD-883, Method 2037
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