


Bond Pull Test for Zener Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Zener Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
42181 results found for Zener/Diode/Discretes
Part reference
Quality level / QPL
Package
Power Dissipation [Max]
TID (krads)
Reverse Current [Max]
Zener Impedance [Max]
Zener Voltage [Nom]
Unit price
Lead time
JAN
Qualified
QPDSIS-19500
Surface Mount
DO-213AA
0,5W
2uA
100ohms
6,4V
JANTXV
Qualified
QPDSIS-19500
Through Hole Mount
DO-204AH (DO-35)
0,5W
0,5uA
150ohms
56V
JANS
Qualified
QPDSIS-19500
Through Hole Mount
DO-204AH (DO-35)
0,5W
3uA
25ohms
3,6V
JANTX
Qualified
QPDSIS-19500
Through Hole Mount
DO-204AH (DO-35)
0,5W
0,05uA
150ohms
19V
JANS
Qualified
QPDSIS-19500
Surface Mount
DO-213AA
0,5W
1uA
200ohms
7,5V
JANTX
Qualified
QPDSIS-19500
Surface Mount
LCC-4 (UB)
0,5W
5uA
1550ohms
4,7V
JANTX
Qualified
QPDSIS-19500
Surface Mount
Melf B (US)
0,5W
1uA
5ohms
8,2V
JAN
Qualified
QPDSIS-19500
Point to Point Wiring
DO-203AB (DO-5)
10uA
2ohms
18V
JANTX
Qualified
QPDSIS-19500
Through Hole Mount
DO-204AH (DO-35)
0,5W
0,01uA
400ohms
60V
JAN
Qualified
QPDSIS-19500
Through Hole Mount
DO-204AH (DO-35)