


Bond Pull Test for Zener Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Zener Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
42181 results found for Zener/Diode/Discretes
Part reference
Quality level / QPL
Package
Power Dissipation [Max]
TID (krads)
Reverse Current [Max]
Zener Impedance [Max]
Zener Voltage [Nom]
Unit price
Lead time
JANS
Qualified
QPDSIS-19500
Surface Mount
Melf A (US)
1,5W
0,05uA
25ohms
33V
JANS
Qualified
QPDSIS-19500
Surface Mount
Melf E (US)
5W
2uA
42ohms
62V
JANTXV
Qualified
QPDSIS-19500
Point to Point Wiring
DO-203AB (DO-5)
10uA
2,5ohms
22V
JAN
Qualified
QPDSIS-19500
Surface Mount
LCC-4 (UB)
0,5W
0,05uA
100ohms
16V
JANTXV
Qualified
QPDSIS-19500
Through Hole Mount
DO-204AH (DO-35)
0,5W
0,01uA
100ohms
28V
JANS
Qualified
QPDSIS-19500
Surface Mount
DO-213AA
0,5W
0,01uA
1,6ohms
100V
JANTXV
Qualified
QPDSIS-19500
Through Hole Mount
DO-204AH (DO-35)
0,5W
0,5uA
200ohms
10V
JANTX
Qualified
QPDSIS-19500
Surface Mount
Melf A (US)
1,5W
0,05uA
30ohms
39V
JANS
Qualified
QPDSIS-19500
Surface Mount
Melf E (US)
5W
2uA
42ohms
62V
JANTX
Qualified
QPDSIS-19500
Surface Mount
LCC-4 (UB)