


Cross Sectioning for VCO Oscillator
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for VCO Oscillator
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
14 results found for VCO/Frequency Generation/RF-Microwave Microcircuits/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
QFN-32
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
QFN-32
QML H
Not qualified
QPDSIS-38534
Surface Mount
CQLCC-20
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-16
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
883
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
ESCC B
Not qualified
ESCC QPL
DIE
DIE
883
Qualified
QPDSIS-38535
Surface Mount
CFP-16
ESCC B
Not qualified
ESCC QPL
DIE
DIE
Part validation activities
Cost & Activity Matrix