Servicio Familia 
Bond Pull Test for VCO Oscillator
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for VCO Oscillator
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
14 results found for VCO/Frequency Generation/RF-Microwave Microcircuits/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
QFN-32
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
QFN-32
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-16
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
QML H
Not qualified
QPDSIS-38534
Surface Mount
CQLCC-20
ESCC C
Not qualified
ESCC QPL
DIE
DIE
883
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
ESCC B
Not qualified
ESCC QPL
DIE
DIE
883
Qualified
QPDSIS-38535
Surface Mount
CFP-16
ESCC B
Not qualified
ESCC QPL
DIE
DIE
Part validation activities
Cost & Activity Matrix