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doEEEt Bond Pull Test for UV EPROM Memory | doEEEt.com
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Bond Pull Test for UV EPROM Memory

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

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EEE Parts Results Page

Bond Pull Test for UV EPROM Memory

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

EEE Parts Results Page

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  • Microcircuits
    • Digital
      • Memory
        • ROM
          • UV EPROM

469 results found for UV EPROM/ROM/Memory/Digital/Microcircuits

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Part reference
Quality level / QPL
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Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time

5962-8764814QXA
AS27C512-25JM
Micross Components
5962-87648

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28
250 ns
512K (64K x 8)

5962-8751511LA
CY7C263-25WMB
Teledyne e2v Inc
5962-87515

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-24
25 ns
64K (8K x 8)

5962-8606303YC
QP27C256-300/YC
Teledyne e2v Inc
5962-86063

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-32
300 ns
256K (32K x 8)

5962-8606314XA
QP27C256-170/XA
Teledyne e2v Inc
5962-86063

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28
170 ns
256K (32K x 8)

5962-8606316UA
QP27C256-120/UA
Teledyne e2v Inc
5962-86063

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28
120 ns
256K (32K x 8)

5962-8606312XA
QP27C256-250/XA
Teledyne e2v Inc
5962-86063

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28
250 ns
256K (32K x 8)

5962-8680506XA
EV27C1024-12/XA
Teledyne e2v Inc
5962-86805

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-44
120 ns
1M (64K x 16)

5962-87515043C
QP7C263-90QMB
Teledyne e2v Inc
5962-87515

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-28
90 ns
64K (8K x 8)

5962-8606316XA
QP27C256-120/XA
Teledyne e2v Inc
5962-86063

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28
120 ns
256K (32K x 8)

5962-8680502XA
EV27C1024-25/XA
Teledyne e2v Inc
5962-86805

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-44
250 ns
1M (64K x 16)
Part validation activities
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