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Bond Pull Test for UV EPROM Memory
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for UV EPROM Memory
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
469 results found for UV EPROM/ROM/Memory/Digital/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
250 ns
256K (32K x 8)
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CQLCC-28
15 ns
64K (8K x 8)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
45 ns
256K (32K x 8)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
250 ns
512K (64K x 8)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-28
150 ns
256K (32K x 8)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
150 ns
256K (32K x 8)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-32
70 ns
256K (32K x 8)
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-28
25 ns
16K (2K x 8)
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CQLCC-32
55 ns
256K (32K x 8)
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-24
25 ns
64K (8K x 8)
Part validation activities
Cost & Activity Matrix