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Cross Sectioning for Transistor-Diode Array
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Transistor-Diode Array
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
59 results found for Transistor-Diode Array/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
JAN B
Not qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
QML H
Not qualified
QPDSIS-38534
Surface Mount
Hybrid PKG-4
SPACE
Not qualified
ADI Space QPL
Through Hole Mount
TO-99
SPACE
Not qualified
ADI Space QPL
Surface Mount
CFP-10
SPACE
Not qualified
ADI Space QPL
DIE
DIE
PROTO
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-16
TESTED DIE
Not qualified
NOT LISTED IN QPL
DIE
DIE
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-16
QML V
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
Part validation activities
Cost & Activity Matrix