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Bond Pull Test for Transistor-Diode Array
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Transistor-Diode Array
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
59 results found for Transistor-Diode Array/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-20 (Gull Wing)
JAN B
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-18
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-18
QML V
Qualified
QPDSIS-38535
DIE
DIE
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-16
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-16
SPACE
Not qualified
ADI Space QPL
Surface Mount
CFP-10
QML V
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
Part validation activities
Cost & Activity Matrix