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doEEEt Bond Pull Test for Transistor-Diode Array | doEEEt.com
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Bond Pull Test for Transistor-Diode Array

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

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EEE Parts Results Page

Bond Pull Test for Transistor-Diode Array

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

EEE Parts Results Page

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  • Microcircuits
    • Signal Acquisition-Conditioning
      • Transistor-Diode Array

59 results found for Transistor-Diode Array/Signal Acquisition-Conditioning/Microcircuits

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Package
Unit price
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5962-1621001VXC
LX7710MDWC-V
Microsemi SoC a Microchip Company
5962-16210

Compare DCL / BOM Cart
QML V
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CFP-20 (Gull Wing)

M38510/14103BEA
SG2003J-JAN
Microsemi a Microchip Company
MIL-M-38510/141

Compare DCL / BOM Cart
JAN B
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-16

5962-8968401VA
SG2821J-DESC
Microsemi a Microchip Company
5962-89684

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-18

5962-8605801VA
SG2803J-DESC
Microsemi a Microchip Company
5962-86058

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-18

5962F0721803V9A
ISL73128RHVX
Renesas Electronics formerly Intersil
5962-07218

Compare DCL / BOM Cart
QML V
Qualified
QPDSIS-38535
-55ºC to +125ºC
DIE
DIE

5962F0721801VXC
ISL73096RHVF
Renesas Electronics formerly Intersil
5962-07218

Compare DCL / BOM Cart
QML V
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CFP-16

5962F0721802VXC
ISL73127RHVF
Renesas Electronics formerly Intersil
5962-07218

Compare DCL / BOM Cart
QML V
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CFP-16

MAT03-913L
MAT03-913L
Analog Devices
MFR SPEC ASD0011414

Compare DCL / BOM Cart
SPACE
Not qualified
ADI Space QPL
-55ºC to +125ºC
Surface Mount
CFP-10

5962-9053801V2A
UC1611LQMLV
Texas Instruments
5962-90538

Compare DCL / BOM Cart
QML V
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-20

5962-86058012A
SG2803L-DESC
Microsemi a Microchip Company
5962-86058

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-20
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