


Bond Pull Test for Toggle Switches
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Toggle Switches
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
2051 results found for Toggle/Switches
Part reference
Quality level / QPL
Package
Contact Configuration
Rated Current
Unit price
Lead time
NON-ER
Qualified
QPDSIS-3950
NON-ER
Qualified
QPDSIS-3950
NON-ER
Qualified
QPDSIS-3950
NON-ER
Qualified
QPDSIS-3950
NON-ER
Qualified
QPDSIS-3950
NON-ER
Qualified
QPDSIS-3950
NON-ER
Qualified
QPDSIS-3950
NON-ER
Qualified
QPDSIS-3950
NON-ER
Qualified
QPDSIS-3950
NON-ER
Qualified
QPDSIS-3950
Part validation activities
Cost & Activity Matrix