Skip to Content
  • Resources
    • COTS For Space WEBINARS
    • EEE Components
    • SPECIFICATIONS / QPLs
    • Events / Webinars
    • Space Talks
    • Tech Articles
    • Manufacturer Notifications
  • Laboratory Services
    • Laboratory Standard Testing
    • Non Standard Testing
    • Silicon Carbide -SiC- Diodes
    • CrowdTesting
    • Optoelectronics
    • Small Sats
    • Representative Projects / Papers
  • Additional Services
    • Industry 4.0 Cybersecurity (IEC 62443) NEW
    • Penetration Test NEW
    • Cybersecurity Certified (CSC) NEW
    • Code Score Matrix NEW
    • Long-term storage of wafers
    • Electronic Design
  • Tools
    • Comparator
    • MYDCLs / BOMs
    • esa-stockplace
  • About Us
  • Proposal Next
  • Sign In
Cookies on the doEEEt website. We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we'll assume that you are happy to receive all cookies on the doEEEt website. However, if you would like to, you can change your cookie settings at any time. Link to cookies policy.
doEEEt Bond Pull Test for Toggle Switches | doEEEt.com
  • Home
  • How does doEEEt works
  • About us
  • Contact Us
  • Terms of Use
  • Disclaimer
  • Privacy Policy
  • Privacy Policy and Legal Notice
  • Cookie Policy
  • Copyright
  • autosignup2
  • Instant Quote
  • Introducing NanoXplore And Its European FPGA’s ITAR Free
  • Space Talks 3 - Dan Friedlander
  • autosignup3
  • Shopping Cart
  • wpo
  • Data Protection
  • Components
  • Documents
Please enter at least one character to search
ALTER Laboratory Services
Servicio Familia Servicio Familia
Image
Image

Bond Pull Test for Toggle Switches

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

Fill the form to receive expert assistance from our skilled engineers and technicians

Read Policy

Related content

X-Ray Inspection applied to DPA test

Non-destructive internal inspection of EEE parts and passive components

electrical testing

Alter Technology SAM Additional Testing Capabilities

procurement-EEE-Parts

Reasons to do an Element Evaluation Procedure of EEE Parts

EEE Parts Results Page

Bond Pull Test for Toggle Switches

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

EEE Parts Results Page

Applications expected requirements
Category
Category
Recommended
More...
Close
  • Switches
    • Toggle

2051 results found for Toggle/Switches

Reset
Part reference
Quality level / QPL
TOP
Package
Contact Configuration
Rated Current
Unit price
Lead time

M3950/15-14B1/110
121441R0.38X778
APEM Components Inc
MIL-DTL-3950/15

Compare DCL / BOM Cart
NON-ER
Qualified
QPDSIS-3950

MS27781-22G
MS27781
Honeywell Sensing and Productivity Solutions
MS27781

Compare DCL / BOM Cart
NON-ER
Qualified
QPDSIS-3950

MS27734-32
MS27734
Honeywell Sensing and Productivity Solutions
MS27734

Compare DCL / BOM Cart
NON-ER
Qualified
QPDSIS-3950

M3950/16-27D113V
122570.383VX778
APEM Components Inc
MIL-DTL-3950/16

Compare DCL / BOM Cart
NON-ER
Qualified
QPDSIS-3950

MS24658-21P
T9-MS1-21P
Otto Engineering Inc
MS24658

Compare DCL / BOM Cart
NON-ER
Qualified
QPDSIS-3950

MS27783-30F
MS27783
Honeywell Sensing and Productivity Solutions
MS27783

Compare DCL / BOM Cart
NON-ER
Qualified
QPDSIS-3950

M3950/17-16A12V
121660.382VX778
APEM Components Inc
MIL-DTL-3950/17

Compare DCL / BOM Cart
NON-ER
Qualified
QPDSIS-3950

MS27788-21N
MS27788
Safran Electrical and Power
MS27788

Compare DCL / BOM Cart
NON-ER
Qualified
QPDSIS-3950

MS24658-21N
MS24658
Honeywell Sensing and Productivity Solutions
MS24658

Compare DCL / BOM Cart
NON-ER
Qualified
QPDSIS-3950

MS27739-31K
MS27739
Honeywell Sensing and Productivity Solutions
MS27739

Compare DCL / BOM Cart
NON-ER
Qualified
QPDSIS-3950
Part validation activities
Cost & Activity Matrix
  • <
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • >
Alter Technology Laboratory Services
  • Screening
  • Evaluation/Qualification
  • Scanning Acoustic Microscopy
  • RF/Microwave
  • Incoming Inspection
  • DPA

EEE Components
  • Capacitors
  • Microcircuits
  • Resistors
  • Crystals and Oscillators
  • Schottky Barrier Rectifiers
  • Discretes

Laboratory Success Cases
  • GRACE Project
  • XRAY, SAM and Cross Section
  • SiC schottky Diode
  • JUICE Case
  • Deimos Neptuno
  • Melissa III

Company
  • About Us
  • Contact-us
  • How does doEEEt works?
Security & Privacity
  • Privacy Policy and Legal Notice
  • Copyright
  • Contact Clause
  • LinkedIn LinkedIn
  • Twitter Twitter
Copyright © 2025 ALTER TECHNOLOGY TÜV NORD S.A.U
All rights reserved.