


Bond Pull Test for Timer
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Timer
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
32 results found for Timer/Clock and Timing/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Counter Mode
Number of Bits
Number of Timers/Counters
Unit price
Lead time
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-8
Timer/Oscillator
1
QML V
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-8
Timer/Oscillator
1
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
Timer/Oscillator
2
PROTO
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-24
Programmable Timer
16-Bits
3
QML V
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-24
TID (HDR): 100.0
SEL (Let): 60.0
SEU (Let): 22.0
Programmable Timer
16-Bits
3
JAN B
Not qualified
QPDSIS-38535
Through Hole Mount
CDIP-8
Timer/Oscillator
1
JAN B
Qualified
QPDSIS-38535
Through Hole Mount
TO-99
Timer/Oscillator
1
JAN B
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
Timer/Oscillator
2
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-24
TID (HDR): 100.0
SEL (Let): 60.0
SEU (Let): 22.0
Programmable Timer
16-Bits
3
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
TO-100
Timer/Oscillator
1
Part validation activities
Cost & Activity Matrix