Servicio Familia 
Cross Sectioning for Temperature Sensors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Temperature Sensors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
42 results found for Temperature/IC Sensors/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Output Type
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Through Hole Mount
TO-92-3
Digital Output
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
SOT-23
I2C,SMBus,2-Wire
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
SOT-23
SPI,Microwire
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
SOT-23
SPI,Microwire
QML V
Not qualified
QPDSIS-38535
Surface Mount
CFP-2
Analog Output
PROTO
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-2
Analog Output
QML V
Qualified
QPDSIS-38535
DIE
DIE
TID (HDR): 300.0
TID (LDR): 50.0
SEL (Let): 86.0
Analog Output
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
SOT-23
SPI,Microwire
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-2
Analog Output
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
TO-52
Analog Output
Part validation activities
Cost & Activity Matrix