Servicio Familia 
Bond Pull Test for Temperature Sensors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Temperature Sensors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
42 results found for Temperature/IC Sensors/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Output Type
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Through Hole Mount
TO-92-3
Digital Output
QML V
Qualified
QPDSIS-38535
Through Hole Mount
TO-52
TID (HDR): 100.0
Analog Output
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-2
TID (HDR): 100.0
Analog Output
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
SOT-23
I2C,SMBus,2-Wire
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
SOT-23
SPI,Microwire
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
SOT-23
SPI,Microwire
QML V
Not qualified
QPDSIS-38535
Surface Mount
CFP-2
Analog Output
PROTO
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-2
Analog Output
QML V
Qualified
QPDSIS-38535
DIE
DIE
TID (HDR): 300.0
TID (LDR): 50.0
SEL (Let): 86.0
Analog Output
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
SOT-23
I2C,SMBus
Part validation activities
Cost & Activity Matrix