


Cross Sectioning for Tantalum Solid
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Tantalum Solid
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
476777 results found for Tantalum Solid/Capacitors
Part reference
Quality level / QPL
Package
Capacitance [Nom]
DC Rated Voltage
Tolerance
Unit price
Lead time
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
680nF
20V
±10%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
2,2uF
50V
±20%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
4,7uF
20V
±20%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
15uF
10V
±20%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
22uF
15V
±20%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
330nF
35V
±5%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
680nF
35V
±10%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
3,3uF
4V
±5%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
150nF
35V
±5%
SPACE
Qualified
JAXA QPL
Surface Mount
Chip
330nF
35V
±10%
Part validation activities
Cost & Activity Matrix