Skip to Content
  • Resources
    • COTS For Space WEBINARS
    • EEE Components
    • SPECIFICATIONS / QPLs
    • Events / Webinars
    • Space Talks
    • Tech Articles
    • Manufacturer Notifications
  • Laboratory Services
    • Laboratory Standard Testing
    • Non Standard Testing
    • Silicon Carbide -SiC- Diodes
    • CrowdTesting
    • Optoelectronics
    • Small Sats
    • Representative Projects / Papers
  • Additional Services
    • Industry 4.0 Cybersecurity (IEC 62443) NEW
    • Penetration Test NEW
    • Cybersecurity Certified (CSC) NEW
    • Code Score Matrix NEW
    • Long-term storage of wafers
    • Electronic Design
  • Tools
    • Comparator
    • MYDCLs / BOMs
    • esa-stockplace
  • About Us
  • Proposal Next
  • Sign In
Cookies on the doEEEt website. We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we'll assume that you are happy to receive all cookies on the doEEEt website. However, if you would like to, you can change your cookie settings at any time. Link to cookies policy.
doEEEt Cross Sectioning for Tantalum Solid | doEEEt.com
  • Home
  • How does doEEEt works
  • About us
  • Contact Us
  • Terms of Use
  • Disclaimer
  • Privacy Policy
  • Privacy Policy and Legal Notice
  • Cookie Policy
  • Copyright
  • autosignup2
  • Instant Quote
  • Introducing NanoXplore And Its European FPGA’s ITAR Free
  • Space Talks 3 - Dan Friedlander
  • autosignup3
  • Shopping Cart
  • wpo
  • Data Protection
  • Components
  • Documents
Please enter at least one character to search
ALTER Laboratory Services
Servicio Familia Servicio Familia
Image
Image

Cross Sectioning for Tantalum Solid

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

Fill the form to receive expert assistance from our skilled engineers and technicians

Read Policy

Related content

Microsection images.

Test combination for detecting defects in plastic ICs

Importance of SAM for delamination detection

Importance of the SAM for delamination detection

C-Sam-internal-inspection-

SAM Capabilities, Analyse the internal structure in EEE Parts

Microsection Inspection - Failure Analysis

Failure Analysis in Microsection Inspection

Constructional Analysis

Constructional Analysis in Microsection Inspection

EEE Parts Results Page

Cross Sectioning for Tantalum Solid

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

EEE Parts Results Page

Applications expected requirements
Category
Category
Recommended
More...
Close
  • Capacitors
    • Tantalum Solid

476777 results found for Tantalum Solid/Capacitors

Reset
Part reference
Quality level / QPL
TOP
Package
Capacitance [Nom]
DC Rated Voltage
Tolerance
Unit price
Lead time

JAXACWS11JH684K
CWS11 0,68uF 10% 20V 3216 Chip
Matsuo Electric Co Ltd
JAXA-QTS-2040/K201

Compare DCL / BOM Cart
SPACE
Qualified
JAXA QPL
-55ºC to +125ºC
Surface Mount
Chip
680nF
20V
±10%

JAXACWS11NH225M
CWS11 2,2uF 20% 50V 7343 Chip
Matsuo Electric Co Ltd
JAXA-QTS-2040/K201

Compare DCL / BOM Cart
SPACE
Qualified
JAXA QPL
-55ºC to +125ºC
Surface Mount
Chip
2,2uF
50V
±20%

JAXACWS11JH475M
CWS11 4,7uF 20% 20V 6032 Chip
Matsuo Electric Co Ltd
JAXA-QTS-2040/K201

Compare DCL / BOM Cart
SPACE
Qualified
JAXA QPL
-55ºC to +125ºC
Surface Mount
Chip
4,7uF
20V
±20%

JAXACWS11FH156M
CWS11 15uF 20% 10V 6032 Chip
Matsuo Electric Co Ltd
JAXA-QTS-2040/K201

Compare DCL / BOM Cart
SPACE
Qualified
JAXA QPL
-55ºC to +125ºC
Surface Mount
Chip
15uF
10V
±20%

JAXACWS11HH226M
CWS11 22uF 20% 15V 7343 Chip
Matsuo Electric Co Ltd
JAXA-QTS-2040/K201

Compare DCL / BOM Cart
SPACE
Qualified
JAXA QPL
-55ºC to +125ºC
Surface Mount
Chip
22uF
15V
±20%

JAXACWS11MH334J
CWS11 0,33uF 5% 35V 3216 Chip
Matsuo Electric Co Ltd
JAXA-QTS-2040/K201

Compare DCL / BOM Cart
SPACE
Qualified
JAXA QPL
-55ºC to +125ºC
Surface Mount
Chip
330nF
35V
±5%

JAXACWS11MH684K
CWS11 0,68uF 10% 35V 3528 Chip
Matsuo Electric Co Ltd
JAXA-QTS-2040/K201

Compare DCL / BOM Cart
SPACE
Qualified
JAXA QPL
-55ºC to +125ºC
Surface Mount
Chip
680nF
35V
±10%

JAXACWS11CH335J
CWS11 3,3uF 5% 4V 3216 Chip
Matsuo Electric Co Ltd
JAXA-QTS-2040/K201

Compare DCL / BOM Cart
SPACE
Qualified
JAXA QPL
-55ºC to +125ºC
Surface Mount
Chip
3,3uF
4V
±5%

JAXACWS11MH154J
CWS11 0,15uF 5% 35V 3216 Chip
Matsuo Electric Co Ltd
JAXA-QTS-2040/K201

Compare DCL / BOM Cart
SPACE
Qualified
JAXA QPL
-55ºC to +125ºC
Surface Mount
Chip
150nF
35V
±5%

JAXACWS11MH334K
CWS11 0,33uF 10% 35V 3216 Chip
Matsuo Electric Co Ltd
JAXA-QTS-2040/K201

Compare DCL / BOM Cart
SPACE
Qualified
JAXA QPL
-55ºC to +125ºC
Surface Mount
Chip
330nF
35V
±10%
Part validation activities
Cost & Activity Matrix
  • <
  • 1
  • 2
  • 3
  • 4
  • 5
  • 6
  • 7
  • 8
  • 9
  • >
Alter Technology Laboratory Services
  • Screening
  • Evaluation/Qualification
  • Scanning Acoustic Microscopy
  • RF/Microwave
  • Incoming Inspection
  • DPA

EEE Components
  • Capacitors
  • Microcircuits
  • Resistors
  • Crystals and Oscillators
  • Schottky Barrier Rectifiers
  • Discretes

Laboratory Success Cases
  • GRACE Project
  • XRAY, SAM and Cross Section
  • SiC schottky Diode
  • JUICE Case
  • Deimos Neptuno
  • Melissa III

Company
  • About Us
  • Contact-us
  • How does doEEEt works?
Security & Privacity
  • Privacy Policy and Legal Notice
  • Copyright
  • Contact Clause
  • LinkedIn LinkedIn
  • Twitter Twitter
Copyright © 2025 ALTER TECHNOLOGY TÜV NORD S.A.U
All rights reserved.