


Bond Pull Test for Tantalum Non-Solid
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Tantalum Non-Solid
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
28023 results found for Tantalum Non-Solid/Capacitors
Part reference
Quality level / QPL
Package
Capacitance [Nom]
DC Rated Voltage
Temperature Coefficient of Capacitance
Tolerance
Unit price
Lead time
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
1,2mF
25V
±10%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
560uF
25V
±10%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
Case C
50uF
60V
Not Available
±20%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
Case B
160uF
25V
Not Available
±10%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
Case B
120uF
8V
Not Available
±20%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
Case D
390uF
50V
Not Available
±20%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
Case D
330uF
63V
Not Available
±20%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
Case A
15uF
30V
Not Available
±10%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
Case D
160uF
50V
Not Available
±10%
ESCC B
Not qualified
ESCC QPL
Through Hole Mount
Axial
Case C