


Bond Pull Test for TVS Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for TVS Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
3679 results found for Transient Suppressor -TVS-/Diode/Discretes
Part reference
Quality level / QPL
Package
TID (krads)
Clamping Voltage [Max]
Peak Pulse Current [Max]
Repetitive Peak Pulse Power Dissipation [Max]
Working Peak Reverse Voltage [Max]
Unit price
Lead time
JANTXV
Qualified
QPDSIS-19500
Surface Mount
Melf E (US)
125,1V
12A
1500W
69,2V
JANTX
Qualified
QPDSIS-19500
Through Hole Mount
DO-202AA (DO-13)
92V
16,3A
1500W
58V
JANS
Qualified
QPDSIS-19500
Surface Mount
Melf E (US)
23,4V
64,1A
1500W
12,2V
JANS
Qualified
QPDSIS-19500
Surface Mount
Melf E (US)
37,4V
13,4A
500W
20,6V
JANTX
Qualified
QPDSIS-19500
Surface Mount
Melf E (US)
12,1V
41,3A
500W
6,2V
JANS
Qualified
QPDSIS-19500
Surface Mount
Melf E (US)
80,7V
6,2A
500W
42,6V
JANTX
Qualified
QPDSIS-19500
Through Hole Mount
DO-202AA (DO-13)
328V
4,6A
1500W
185V
JAN
Qualified
QPDSIS-19500
Surface Mount
Melf E (US)
52,3V
9,6A
500W
27,4V
JAN
Qualified
QPDSIS-19500
Surface Mount
Melf E (US)
216,2V
2,3A
500W
114V
JANTXV
Qualified
QPDSIS-19500
Through Hole Mount
DO-202AA (DO-13)