


Cross Sectioning for Synchro-Resolver Converter
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Synchro-Resolver Converter
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
348 results found for Synchro-Resolver to Digital/Data Converter/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
QML K
Qualified
QPDSIS-38534
Surface Mount
CQFP-52
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-34
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-36
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-36
QML H
Qualified
QPDSIS-38534
Surface Mount
CFP-36
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-36
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-36
QML H
Qualified
QPDSIS-38534
Surface Mount
CFP-36
QML H
Qualified
QPDSIS-38534
Surface Mount
CFP-36
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-36
Part validation activities
Cost & Activity Matrix