Servicio Familia 
Bond Pull Test for Supervisory-Monitoring ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Supervisory-Monitoring ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
329 results found for Supervisory and Monitoring/Power Management/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SC70-3
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
CQLCC-20
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-8
883
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-8
883
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-20
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
SC70-5
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
SC70-5
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
SC70-5
QML Q
Not qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
883
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-20
Part validation activities
Cost & Activity Matrix