


Cross Sectioning for Source and Motor Drivers
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Source and Motor Drivers
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
47 results found for Source and Motor Drivers/Driver/Power Management/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Through Hole Mount
TO-220-11
PROTO
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-28
PROTO
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-44
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-18
QML H
Qualified
QPDSIS-38534
Through Hole Mount
TO-3
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
CQFP-132
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-20
EP
Not qualified
NOT LISTED IN QPL
Through Hole Mount
PDIP-28
QML V
Qualified
QPDSIS-38535
Surface Mount
CQLCC-44
Part validation activities
Cost & Activity Matrix