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Bond Pull Test for Solid State Relays
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Solid State Relays
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
18 results found for Solid State/Relays
Part reference
Quality level / QPL
Package
Contact Configuration
Input Voltage [Max]
Input Voltage [Min]
Output Current [Max]
Output Voltage [Max]
Output Voltage [Min]
Unit price
Lead time
HIGH RELIABILITY STD.
Not qualified
QPDSIS-28750
Through Hole Mount
DIL-4
SPST
HIGH RELIABILITY STD.
Qualified
QPDSIS-28750
Point to Point Wiring
Solder Hook (No mount)
SPST
HIGH RELIABILITY STD.
Qualified
QPDSIS-28750
Point to Point Wiring
Solder Hook (No mount)
SPST
HIGH RELIABILITY STD.
Not qualified
QPDSIS-28750
Through Hole Mount
TO-5
SPST
HIGH RELIABILITY STD.
Not qualified
QPDSIS-28750
Point to Point Wiring
Solder Hook (No mount)
SPST
GENERAL PURPOSE
Not qualified
QPDSIS-28750
Point to Point Wiring
Solder Hook (No mount)
SPST
GENERAL PURPOSE
Not qualified
QPDSIS-28750
Through Hole Mount
DIL-4
SPST
HIGH RELIABILITY STD.
Not qualified
QPDSIS-28750
Point to Point Wiring
Solder Hook (No mount)
SPST
GENERAL PURPOSE
Not qualified
QPDSIS-28750
Point to Point Wiring
Solder Hook (No mount)
SPST
HIGH RELIABILITY STD.
Not qualified
QPDSIS-28750
Through Hole Mount
TO-5
SPST