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doEEEt Cross Sectioning for Solid State Relay | doEEEt.com
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Cross Sectioning for Solid State Relay

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

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EEE Parts Results Page

Cross Sectioning for Solid State Relay

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

EEE Parts Results Page

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  • Microcircuits
    • Power Management
      • Solid State Relay

111 results found for Solid State Relay/Power Management/Microcircuits

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Part reference
Quality level / QPL
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Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time

AQY221R2SZ
AQY221R2SZ
Panasonic Industry
MFR DS ASCTB156E

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
SOP-4

53259-PC-K
53259-PC-K
Micropac Industries Inc
MFR DS 53259

Compare DCL / BOM Cart
CLASS K EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Through Hole Mount
CDIP-8

53252-117
53252-117
Micropac Industries Inc
MFR DS 53252

Compare DCL / BOM Cart
CLASS H EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-8 (Gull Wing)

53259-XC-H
53259-XC-H
Micropac Industries Inc
MFR DS 53259

Compare DCL / BOM Cart
CLASS H EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-8 (Gull Wing)

MPC-53502-100-01-AS
MPC-53502-100-01-AS
Micropac Industries Inc
MFR DS 53502 EM

Compare DCL / BOM Cart
HIREL UNSCREENED
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
Hybrid FP-10

5962-1324901KXA
RDHA710SE10A2FK
International Rectifier HIREL an Infineon Company
5962-13249

Compare DCL / BOM Cart
QML K
Qualified
QPDSIS-38534
-55ºC to +95ºC
Surface Mount
SIP-8 (Gull Wing)

5962-0324701HYC
53252-108
Micropac Industries Inc
5962-03247

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CDIP-8

5962-9314001HYC
53111-1HYC
Micropac Industries Inc
5962-93140

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CDIP-8

5962-9314001HZC
53111-1HZC
Micropac Industries Inc
5962-93140

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CDIP-8

5962-9314004HXA
53115-4HXA
Micropac Industries Inc
5962-93140

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CDIP-8
Part validation activities
Cost & Activity Matrix
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