Servicio Familia 
Cross Sectioning for Solid State Relay
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Solid State Relay
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
111 results found for Solid State Relay/Power Management/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOP-4
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-8
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-8
CLASS K EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-8 (Gull Wing)
TID (HDR): 100.0
CLASS K EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-8 (Gull Wing)
TID (HDR): 100.0
CLASS K EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-8 (Gull Wing)
TID (HDR): 100.0
QML E
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-8
HIREL UNSCREENED
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-8 (Gull Wing)
TID (HDR): 100.0
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-8
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-8
Part validation activities
Cost & Activity Matrix