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doEEEt Bond Pull Test for Solid State Relay | doEEEt.com
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Bond Pull Test for Solid State Relay

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

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EEE Parts Results Page

Bond Pull Test for Solid State Relay

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

EEE Parts Results Page

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  • Microcircuits
    • Power Management
      • Solid State Relay

111 results found for Solid State Relay/Power Management/Microcircuits

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Part reference
Quality level / QPL
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Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time

AQY221R2SZ
AQY221R2SZ
Panasonic Industry
MFR DS ASCTB156E

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
SOP-4

RDHA710SE10A2QK
RDHA710SE10A2QK
International Rectifier HIREL an Infineon Company
MFR DS PD-95876

Compare DCL / BOM Cart
CLASS K EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
SIP-8 (Gull Wing)
TID (HDR): 100.0

53253-125
53253-125
Micropac Industries Inc
MFR DS 53253

Compare DCL / BOM Cart
CLASS K EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-8 (Gull Wing)
TID (HDR): 100.0

53253-112
53253-112
Micropac Industries Inc
MFR DS 53253

Compare DCL / BOM Cart
CLASS H EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-8 (Gull Wing)
TID (HDR): 100.0

5962-0324702HZA
53252-2HZA
Micropac Industries Inc
5962-03247

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CDIP-8

5962-9314003HXC
53111-3HXC
Micropac Industries Inc
5962-93140

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CDIP-8

5962-9314004HPA
53115-4HPA
Micropac Industries Inc
5962-93140

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CDIP-8

5962-9314002EPA
ASSR-7112E-200
Avago Technologies
5962-93140

Compare DCL / BOM Cart
QML E
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CDIP-8

53259-XC-H
53259-XC-H
Micropac Industries Inc
MFR DS 53259

Compare DCL / BOM Cart
CLASS H EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Surface Mount
CFP-8 (Gull Wing)

53259-PC-K
53259-PC-K
Micropac Industries Inc
MFR DS 53259

Compare DCL / BOM Cart
CLASS K EQ
Not qualified
NOT LISTED IN QPL
-55ºC to +125ºC
Through Hole Mount
CDIP-8
Part validation activities
Cost & Activity Matrix
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