


Bond Pull Test for Schottky Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Schottky Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
8 results found for Schottky/RF-Microwave Diode/Diode/Discretes
Part reference
Quality level / QPL
Package
Power Dissipation [Max]
TID (krads)
Forward Current [Max]
Total Capacitance [Max]
Unit price
Lead time
ESCC
Not qualified
ESCC QPL
Surface Mount
HPAC-140
70mA
ESCC
Qualified
ESCC QPL
Surface Mount
T1
0,25W
120mA
4pF
ESCC C
Not qualified
ESCC QPL
Surface Mount
HPAC-140
70mA
ESCC C
Not qualified
ESCC QPL
Surface Mount
T1
0,25W
120mA
4pF
ESCC
Qualified
ESCC QPL
Surface Mount
T1
0,25W
70mA
2pF
ESCC
Qualified
ESCC QPL
Surface Mount
T1
0,25W
70mA
2pF
ESCC C
Not qualified
ESCC QPL
Surface Mount
T1
0,25W
70mA
2pF
ESCC
Qualified
ESCC QPL
Surface Mount
T1
0,25W
120mA
4pF
Part validation activities
Cost & Activity Matrix