Servicio Familia 
Bond Pull Test for Schottky Barrier Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Schottky Barrier Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
831 results found for Schottky Barrier Rectifiers/Diode/Discretes
Part reference
Quality level / QPL
Package
TID (krads)
Average Output Rectified Current [Max]
Forward Surge Current [Max]
Working Peak Reverse Voltage [Max]
Unit price
Lead time
JANTXV
Qualified
QPDSIS-19500
Surface Mount
TO-276AA (SMD.5)
10A
200A
35V
JAN
Qualified
QPDSIS-19500
Surface Mount
TO-276AA (SMD.5)
30A
140A
150V
JANTX
Qualified
QPDSIS-19500
Through Hole Mount
TO-254AA
15A
300A
45V
JANTX
Qualified
QPDSIS-19500
Surface Mount
TO-276AA (SMD.5)
10A
200A
35V
JAN
Qualified
QPDSIS-19500
Through Hole Mount
TO-254AA
35A
175A
100V
JANS
Qualified
QPDSIS-19500
Surface Mount
DO-213AB
1A
25A
20V
JANTXV
Qualified
QPDSIS-19500
Surface Mount
TO-276AA (SMD.5)
30A
140A
150V
JANS EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
TO-257AA
16A
45V
JANS EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
TO-254AA
35A
45V
JANS EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
D2
16A
45V
Part validation activities
Cost & Activity Matrix