Servicio Familia 
Bond Pull Test for Schottky Barrier Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Schottky Barrier Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
831 results found for Schottky Barrier Rectifiers/Diode/Discretes
Part reference
Quality level / QPL
Package
TID (krads)
Average Output Rectified Current [Max]
Forward Surge Current [Max]
Working Peak Reverse Voltage [Max]
Unit price
Lead time
JANTX
Qualified
QPDSIS-19500
Surface Mount
TO-276AB (SMD1)
35A
200A
150V
JANTX
Qualified
QPDSIS-19500
Surface Mount
ThinKey 3
150A
2000A
30V
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
TO-254AA
15A
300A
45V
JANTX
Qualified
QPDSIS-19500
Through Hole Mount
DO-204AL (DO-41)
3A
80A
40V
JANS EQ
Not qualified
NOT LISTED IN QPL
Through Hole Mount
TO-257AA
16A
45V
JANS EQ
Not qualified
NOT LISTED IN QPL
Surface Mount
TO-276AA (SMD.5)
8,5A
45V
JANS
Qualified
QPDSIS-19500
Through Hole Mount
DO-204AL (DO-41)
1A
25A
100V
JAN
Qualified
QPDSIS-19500
Surface Mount
TO-276AA (SMD.5)
30A
300A
45V
JANTX
Qualified
QPDSIS-19500
Through Hole Mount
TO-257AA
16A
120A
150V
JANTX
Qualified
QPDSIS-19500
Surface Mount
TO-276AA (SMD.5)
30A
140A
150V
Part validation activities
Cost & Activity Matrix