


Cross Sectioning for Sample and Hold Amplifier
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Sample and Hold Amplifier
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
23 results found for Sample and Hold/Amplifier/Signal Acquisition-Conditioning/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
SPACE
Not qualified
ADI Space QPL
Surface Mount
CFP-14
JAN B
Qualified
QPDSIS-38535
Through Hole Mount
TO-99
JAN S
Qualified
QPDSIS-38535
Through Hole Mount
TO-99
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-20
SPACE
Not qualified
ADI Space QPL
Surface Mount
CFP-14
PROTO
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-14
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
TO-99
PROTO
Not qualified
NOT LISTED IN QPL
Through Hole Mount
CDIP-14
SPACE
Not qualified
ADI Space QPL
Through Hole Mount
CDIP-14
JAN S
Not qualified
QPDSIS-38535
Through Hole Mount
TO-99
Part validation activities
Cost & Activity Matrix