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Cross Sectioning for SRAM Memory

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

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EEE Parts Results Page

Cross Sectioning for SRAM Memory

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

EEE Parts Results Page

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          • SRAM

6088 results found for SRAM/RAM/Memory/Digital/Microcircuits

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Part reference
Quality level / QPL
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Package
TID (krads)
SEE (MeV/mg/cm2)
Access Time [Max]
Memory Size
Unit price
Lead time

71024S12TYGI
71024S12TYGI
Renesas Electronics formerly Intersil
MFR DS 71024S

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
SOJ-32
12ns
1M (128K x 8)

5962-8855201XA
P4C1256L-100DWMB
Pyramid Semiconductor
5962-88552

Compare DCL / BOM Cart
883
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-28
100 ns
256K (32K x 8)

5962-3829416MUA
P4C164L-20LSMB
Pyramid Semiconductor
5962-38294

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQLCC-28
20 ns
64K (8K x 8)

5962-9559504HBC
WS128K32-70G1TQ
Mercury Systems Inc
5962-95595

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Surface Mount
CQFP-68 (Gull Wing)
70 ns
4M (128K x 32)

8403609JA
P4C116-45CWMB
Pyramid Semiconductor
84036

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-24
45 ns
16K (2K x 8)

5962-8855212NA
P4C1256L-15FMB
Pyramid Semiconductor
5962-88552

Compare DCL / BOM Cart
883
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CFP-28
15 ns
256K (32K x 8)

5962-8861011UA
QP7133SA55FB
Teledyne e2v Inc
5962-88610

Compare DCL / BOM Cart
QML Q
Not qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CQFP-68
55 ns
32K (2K x 16)

5962-8670502RA
P4C168L-25DMB
Pyramid Semiconductor
5962-86705

Compare DCL / BOM Cart
QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-20
25 ns
16K (4K x 4)

5962-9559502HMA
WS128K32-100G2Q
Mercury Systems Inc
5962-95595

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Surface Mount
CQFP-68 (Gull Wing)
100 ns
4M (128K x 32)

5962-9561320HYC
WMS512K8L-45C
Mercury Systems Inc
5962-95613

Compare DCL / BOM Cart
QML H
Qualified
QPDSIS-38534
-55ºC to +125ºC
Through Hole Mount
CDIP-32
45 ns
4M (512K x 8)
Part validation activities
Cost & Activity Matrix
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