


Bond Pull Test for SPLD and CPLD
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for SPLD and CPLD
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
1074 results found for SPLD and CPLD/Programmable Logic/Digital/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-24
JAN S
Qualified
QPDSIS-38535
Not Available
Not Available
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-24
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQCC-84 (J-Lead)
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CFP-20
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-24
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-24
JAN B
Qualified
QPDSIS-38535
Through Hole Mount
CPGA-84
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQCC-44 (J-Lead)
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-24
Part validation activities
Cost & Activity Matrix