


Cross Sectioning for SPACEWIRE ICs
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for SPACEWIRE ICs
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
29 results found for SPACEWIRE Protocol/Communication-Interface/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
QML V
Qualified
QPDSIS-38535
Surface Mount
CQFP-352
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQFP-352
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-28
QML V
Qualified
QPDSIS-38535
Surface Mount
CLGA-255
QML Q
Qualified
QPDSIS-38535
DIE
DIE
QML V
Not qualified
QPDSIS-38535
Surface Mount
MCGA-349
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-28
QML V
Qualified
QPDSIS-38535
Surface Mount
CQFP-352
QML Q
Not qualified
QPDSIS-38535
Surface Mount
MCGA-349
QML Q
Qualified
QPDSIS-38535
Surface Mount
CLGA-255
Part validation activities
Cost & Activity Matrix