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Bond Pull Test for SPACEWIRE ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for SPACEWIRE ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
29 results found for SPACEWIRE Protocol/Communication-Interface/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
MCGA-349
QML V
Qualified
QPDSIS-38535
Surface Mount
CCGA-255
QML Q
Qualified
QPDSIS-38535
Surface Mount
CCGA-255
QML V
Qualified
QPDSIS-38535
Surface Mount
CQFP-352
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQFP-352
QML V
Qualified
QPDSIS-38535
Surface Mount
MCGA-349
QML V
Qualified
QPDSIS-38535
Surface Mount
CLGA-255
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-28
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-28
QML Q
Qualified
QPDSIS-38535
DIE
DIE
Part validation activities
Cost & Activity Matrix