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Bond Pull Test for SCR-Thyristor
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for SCR-Thyristor
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
184 results found for SCR-Thyristor/Discretes
Part reference
Quality level / QPL
Package
TID (krads)
Average Output Rectified Current [Max]
Gate Trigger Current [Max]
Gate Trigger Voltage [Max]
Gate Voltage [Max]
Unit price
Lead time
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
TO-205AD (TO-39)
0,22A
0,35mA
1V
6V
JAN
Not qualified
QPDSIS-19500
Point to Point Wiring
TO-208AA (TO-48)
16A
80mA
3V
5V
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
TO-205AA (TO-5)
0,22A
0,35mA
1V
6V
JANTX
Qualified
QPDSIS-19500
Through Hole Mount
TO-205AA (TO-5)
0,22A
0,075mA
1V
6V
JAN
Qualified
QPDSIS-19500
Point to Point Wiring
TO-208AA (TO-48)
16A
80mA
3V
5V
JANTX
Not qualified
QPDSIS-19500
Through Hole Mount
TO-205AD (TO-39)
0,22A
0,075mA
1V
6V
JANTXV
Not qualified
QPDSIS-19500
Through Hole Mount
TO-205AA (TO-5)
0,22A
0,075mA
1V
6V
JAN
Not qualified
QPDSIS-19500
Through Hole Mount
TO-205AA (TO-5)
0,22A
0,075mA
1V
6V
JANTX
Qualified
QPDSIS-19500
Point to Point Wiring
TO-64
4,7A
30mA
2V
10V
JAN
Qualified
QPDSIS-19500
Through Hole Mount
TO-205AD (TO-39)