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doEEEt Bond Pull Test for RS Protocols ICs | doEEEt.com
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Bond Pull Test for RS Protocols ICs

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

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EEE Parts Results Page

Bond Pull Test for RS Protocols ICs

Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more

EEE Parts Results Page

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  • Microcircuits
    • Communication-Interface
      • 232-422-429-485 Protocols

335 results found for 232-422-429-485 Protocols/Communication-Interface/Microcircuits

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LTC2852MPMS#PBF
LTC2852MPMS#PBF
Linear Technology
MFR DS LTC2850/2851/2852

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
BRONZE
-55ºC to +125ºC
Surface Mount
MSOP-10

MAX14783EAUA+T
MAX14783EAUA+T
Maxim
MFR DS MAX14783E

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +125ºC
Surface Mount
TSSOP-8

LTC2852IMS#PBF
LTC2852IMS#PBF
Linear Technology
MFR DS LTC2850/2851/2852

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
MSOP-10

MAX14783EAUA+
MAX14783EAUA+
Maxim
MFR DS MAX14783E

Compare DCL / BOM Cart
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +125ºC
Surface Mount
TSSOP-8

MAX3280EAUK+T
MAX3280EAUK+T
Maxim
MFR DS MAX3280E/3281E/3283E/32834E

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COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +125ºC
Surface Mount
SOT-23-5

MAX485EESA+
MAX485EESA+
Maxim
MFR DS MAX485

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COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
-40ºC to +85ºC
Surface Mount
SOIC-8

5962-9163901MFA
AM26C31
Texas Instruments
5962-91639

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QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Surface Mount
CFP-16

5962-8688802CA
SNJ55189AJ
Texas Instruments
5962-86888

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QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-14

5962-9172904MEA
MTLT1281QD
Micross Components
5962-91729

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QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-16

5962-7802003MEA
AM26LS32AMJB
Texas Instruments
78020

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QML Q
Qualified
QPDSIS-38535
-55ºC to +125ºC
Through Hole Mount
CDIP-16
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