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Bond Pull Test for RS Protocols ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for RS Protocols ICs
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
335 results found for 232-422-429-485 Protocols/Communication-Interface/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
BRONZE
Surface Mount
MSOP-10
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-8
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
MSOP-10
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-8
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOT-23-5
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOIC-8
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-16
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-16
QML V
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
PROTO
Not qualified
NOT LISTED IN QPL
Surface Mount
CFP-16
Part validation activities
Cost & Activity Matrix