Servicio Familia 
Bond Pull Test for RF Power Amplifier
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for RF Power Amplifier
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
29 results found for Power Amplifier/RF Amplifiers/RF-Microwave Microcircuits/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
QFN-24
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOT-89-3
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOT-89-3
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
Micro-X
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
SOT-89-3
SPACE
Not qualified
NOT LISTED IN QPL
Not Applicable
Not Applicable
SPACE
Not qualified
NOT LISTED IN QPL
Not Applicable
Not Applicable
SPACE
Not qualified
NOT LISTED IN QPL
Not Applicable
Not Applicable
SPACE
Not qualified
NOT LISTED IN QPL
Not Applicable
Not Applicable
ESCC B
Not qualified
ESCC QPL
DIE
DIE
Part validation activities
Cost & Activity Matrix