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Bond Pull Test for RF Mixer
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for RF Mixer
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
11 results found for Mixer/Frequency Conversion/RF-Microwave Microcircuits/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
SPACE
Not qualified
ADI Space QPL
DIE
DIE
SPACE
Not qualified
ADI Space QPL
DIE
DIE
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
Hybrid FP-8
SPACE
Not qualified
ADI Space QPL
Surface Mount
CQLCC-12
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
Hybrid FP-8
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
Hybrid FP-8
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
Hybrid FP-8
EM
Not qualified
NOT LISTED IN QPL
Connectorized
SMA / Feedthrough
SPACE
Not qualified
NOT LISTED IN QPL
Connectorized
SMA / Feedthrough
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
Hybrid FP-8
Part validation activities
Cost & Activity Matrix