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doEEEt Cross Sectioning for RF Inductors | doEEEt.com
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Cross Sectioning for RF Inductors

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

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EEE Parts Results Page

Cross Sectioning for RF Inductors

The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more

EEE Parts Results Page

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  • Inductors
    • RF Inductors

1403 results found for RF Inductors/Inductors

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Part reference
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Package
Inductance [Nom]
Rated Current
Self Resonant Frequency [Min]
Unit price
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M83446/09-40A
M83446/09 33uH 0% Chip
Vanguard
MIL-PRF-83446/9

Compare DCL / BOM Cart
LEVEL M
Qualified
QPDSIS-83446
-55ºC to +125ºC
Surface Mount
Chip
With Tabs
33uH

320100804102K
MSCI 20K 1mH 10% Case C Chip
Exxelia SAS -Site de d´Illange-
ESCC 3201/008

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
Case C
1mH

3201008013L9J
MSCI 10K 3,9uH 5% Case A Chip
Exxelia SAS -Site de d´Illange-
ESCC 3201/008

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
Case A
3,9uH

M83446/09-78F
M83446/09 5,6uH 0% Chip
Coast - Advanced Chip Magnetics
MIL-PRF-83446/9

Compare DCL / BOM Cart
LEVEL M
Qualified
QPDSIS-83446
-55ºC to +125ºC
Surface Mount
Chip
Without Tabs
5,6uH

320100801330G
MSCI 12K 33uH 2% Case B Chip
Exxelia SAS -Site de d´Illange-
ESCC 3201/008

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
Case B
33uH

320100804180K
MSCI 20K 18uH 10% Case C Chip
Exxelia SAS -Site de d´Illange-
ESCC 3201/008

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
Case C
18uH

3201008041L5K
MSCI 20K 1,5uH 10% Case C Chip
Exxelia SAS -Site de d´Illange-
ESCC 3201/008

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
Case C
1,5uH

320100801121G
MSCI 12K 120uH 2% Case B Chip
Exxelia SAS -Site de d´Illange-
ESCC 3201/008

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
Case B
120uH

320100801391G
MSCI 12K 390uH 2% Case B Chip
Exxelia SAS -Site de d´Illange-
ESCC 3201/008

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
Case B
390uH

3201008041L8K
MSCI 20K 1,8uH 10% Case C Chip
Exxelia SAS -Site de d´Illange-
ESCC 3201/008

Compare DCL / BOM Cart
ESCC
Qualified
ESCC QPL
-55ºC to +125ºC
Surface Mount
Chip
Case C
1,8uH
Part validation activities
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