


Cross Sectioning for RF Inductors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for RF Inductors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
1403 results found for RF Inductors/Inductors
Part reference
Quality level / QPL
Package
Inductance [Nom]
Rated Current
Self Resonant Frequency [Min]
Unit price
Lead time
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
0,068uH
LEVEL M
Not qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
6,8uH
LEVEL M
Not qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
0,22uH
LEVEL M
Not qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
0,33uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
With Tabs
27uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
16,5uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
18uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
With Tabs
56uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
With Tabs
1,5uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
With Tabs
22uH
Part validation activities
Cost & Activity Matrix