Servicio Familia 
Bond Pull Test for RF Inductors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for RF Inductors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
1403 results found for RF Inductors/Inductors
Part reference
Quality level / QPL
Package
Inductance [Nom]
Rated Current
Self Resonant Frequency [Min]
Unit price
Lead time
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
0,068uH
LEVEL M
Not qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
6,8uH
LEVEL M
Not qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
0,22uH
LEVEL M
Not qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
0,33uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
With Tabs
27uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
16,5uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
Without Tabs
18uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
With Tabs
56uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
With Tabs
1,5uH
LEVEL M
Qualified
QPDSIS-83446
Surface Mount
Chip
With Tabs
22uH
Part validation activities
Cost & Activity Matrix