


Bond Pull Test for Power Inductors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Power Inductors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
12340 results found for Power Inductors/Inductors
Part reference
Quality level / QPL
Package
Inductance [Nom]
Rated Current
Unit price
Lead time
FAILURE RATE R
Qualified
QPDSIS-39010
Through Hole Mount
Axial
160nH
FAILURE RATE P
Qualified
QPDSIS-39010
Through Hole Mount
Axial
36uH
FAILURE RATE P
Qualified
QPDSIS-39010
Through Hole Mount
Axial
180nH
FAILURE RATE R
Qualified
QPDSIS-39010
Through Hole Mount
Axial
1.8uH
FAILURE RATE R
Qualified
QPDSIS-39010
Through Hole Mount
Axial
5.1uH
FAILURE RATE P
Qualified
QPDSIS-39010
Through Hole Mount
Axial
3uH
FAILURE RATE S
Qualified
QPDSIS-39010
300nH
FAILURE RATE R
Qualified
QPDSIS-39010
Through Hole Mount
Axial
47uH
FAILURE RATE M
Qualified
QPDSIS-39010
Through Hole Mount
Axial
200uH
FAILURE RATE M
Qualified
QPDSIS-39010
Through Hole Mount
Axial
270nH
Part validation activities
Cost & Activity Matrix