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Bond Pull Test for Potentiometer
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Potentiometer
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
117 results found for Potentiometer/Resistors
Part reference
Quality level / QPL
Package
Power Rating
Resistance [Nom]
Temperature Coefficient of Resistance
Tolerance
Unit price
Lead time
HIGH RELIABILITY STD.
Qualified
QPDSIS-27208
Through Hole Mount
Rectangular Solder PIN
0,5" x 0,205" x 0,54" H
750mW
200R
±50ppm/ºC
±5%
HIGH RELIABILITY STD.
Qualified
QPDSIS-27208
Through Hole Mount
Rectangular Solder PIN
0,5" SQ x 0,235" H
750mW
5K00
±50ppm/ºC
±5%
HIGH RELIABILITY STD.
Qualified
QPDSIS-27208
Through Hole Mount
Rectangular Solder PIN
0,375" SQ x 0,195" H
750mW
100R
±50ppm/ºC
±5%
HIGH RELIABILITY STD.
Qualified
QPDSIS-27208
Through Hole Mount
Rectangular Solder PIN
750mW
100R
±50ppm/ºC
±5%
HIGH RELIABILITY STD.
Qualified
QPDSIS-27208
Through Hole Mount
Rectangular Solder PIN
0,250" SQ x 0,165" H
250mW
5K00
±50ppm/ºC
±5%
HIGH RELIABILITY STD.
Qualified
QPDSIS-27208
Point to Point Wiring
Rectangular Wire Leads
0,5" SQ x 0,187" H
750mW
20K0
±50ppm/ºC
±5%
HIGH RELIABILITY STD.
Qualified
QPDSIS-27208
Through Hole Mount
Rectangular Solder PIN
0,5" SQ x 0,235" H
750mW
100R
±50ppm/ºC
±5%
HIGH RELIABILITY STD.
Qualified
QPDSIS-27208
Through Hole Mount
Rectangular Solder PIN
0,5" x 0,205" x 0,54" H
750mW
200R
±50ppm/ºC
±5%
HIGH RELIABILITY STD.
Qualified
QPDSIS-27208
Through Hole Mount
Rectangular Solder PIN
0,250" SQ x 0,165" H
250mW
1K00
±50ppm/ºC
±5%
HIGH RELIABILITY STD.
Qualified
QPDSIS-27208
Through Hole Mount
Rectangular Solder PIN
0,250" SQ x 0,165" H