


Cross Sectioning for Phototransistor
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Phototransistor
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
19 results found for Phototransistor/Transistor/Discretes
Part reference
Quality level / QPL
Package
TID (krads)
Unit price
Lead time
HIREL UNSCREENED
Not qualified
NOT LISTED IN QPL
Not Available
Pigtail
HIREL UNSCREENED
Not qualified
NOT LISTED IN QPL
Not Available
Pigtail
HIREL UNSCREENED
Not qualified
NOT LISTED IN QPL
Not Available
PILL PACK
HIREL SCREENED
Not qualified
NOT LISTED IN QPL
Not Available
Pigtail
HIREL UNSCREENED
Not qualified
NOT LISTED IN QPL
Not Available
Pigtail
HIREL UNSCREENED
Not qualified
NOT LISTED IN QPL
Not Available
Pigtail
HIREL SCREENED
Not qualified
NOT LISTED IN QPL
Not Available
Pigtail
HIREL SCREENED
Not qualified
NOT LISTED IN QPL
Not Available
PILL PACK
JANS EQ
Not qualified
NOT LISTED IN QPL
Not Available
PILL PACK
HIREL SCREENED
Not qualified
NOT LISTED IN QPL
Not Available
PILL PACK
Part validation activities
Cost & Activity Matrix