Servicio Familia 
Bond Pull Test for Phototransistor
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Phototransistor
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
19 results found for Phototransistor/Transistor/Discretes
Part reference
Quality level / QPL
Package
TID (krads)
Unit price
Lead time
HIREL UNSCREENED
Not qualified
NOT LISTED IN QPL
Not Available
Pigtail
HIREL UNSCREENED
Not qualified
NOT LISTED IN QPL
Not Available
Pigtail
HIREL SCREENED
Not qualified
NOT LISTED IN QPL
Not Available
Pigtail
HIREL SCREENED
Not qualified
NOT LISTED IN QPL
Not Available
PILL PACK
JANS EQ
Not qualified
NOT LISTED IN QPL
Not Available
PILL PACK
HIREL SCREENED
Not qualified
NOT LISTED IN QPL
Not Available
PILL PACK
HIREL UNSCREENED
Not qualified
NOT LISTED IN QPL
Not Available
Pigtail
HIREL SCREENED
Not qualified
NOT LISTED IN QPL
Not Available
Pigtail
HIREL UNSCREENED
Not qualified
NOT LISTED IN QPL
Not Available
PILL PACK
ESCC B EQ
Not qualified
NOT LISTED IN QPL
Not Available
PILL PACK
Part validation activities
Cost & Activity Matrix