


Cross Sectioning for Photodiode
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Photodiode
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
1 results found for Photodiode/Diode/Discretes
Part reference
Quality level / QPL
Package
TID (krads)
Unit price
Lead time
ESCC
Not qualified
ESCC QPL
Through Hole Mount
TO-205AD (TO-39)
Part validation activities
Cost & Activity Matrix