


Bond Pull Test for Photodiode
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Photodiode
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
1 results found for Photodiode/Diode/Discretes
Part reference
Quality level / QPL
Package
TID (krads)
Unit price
Lead time
ESCC
Not qualified
ESCC QPL
Through Hole Mount
TO-205AD (TO-39)
Part validation activities
Cost & Activity Matrix