Servicio Familia 
Bond Pull Test for Phase Shifter
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Phase Shifter
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
6 results found for Phase Shifter/Control/RF-Microwave Microcircuits/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
CSL
Not qualified
ADI Space QPL
Surface Mount
CSPBGA-311
ESCC C
Not qualified
ESCC QPL
DIE
DIE
CSL
Not qualified
ADI Space QPL
Surface Mount
CSPBGA-311
ESCC B
Not qualified
ESCC QPL
DIE
DIE
CSL
Not qualified
ADI Space QPL
Surface Mount
CSPBGA-311
CSL
Not qualified
ADI Space QPL
Surface Mount
CSPBGA-311
Part validation activities
Cost & Activity Matrix