Servicio Familia 
Bond Pull Test for Phase Locked Loop
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Phase Locked Loop
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
62 results found for Phase Locked Loop -PLL-/Frequency Generation/RF-Microwave Microcircuits/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
QFN-24
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TQFP-100
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
TSSOP-16
ESCC
Not qualified
ESCC QPL
Surface Mount
CQFP-68
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
CQFP-64 (Gull Wing)
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
LFCSP-20
QML V
Qualified
QPDSIS-38535
Surface Mount
CQFP-64
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-16
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
VQFN-48
Part validation activities
Cost & Activity Matrix