Servicio Familia 
Bond Pull Test for Phase Locked Loop
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Phase Locked Loop
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
60 results found for Phase Locked Loop -PLL-/Frequency Generation/RF-Microwave Microcircuits/Microcircuits
Part reference
Quality level / QPL
Package
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
QFN-24
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TQFP-100
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
CQCC-44 (J-Lead)
EM
Not qualified
NOT LISTED IN QPL
Surface Mount
CQFP-64 (Gull Wing)
SPACE
Not qualified
NOT LISTED IN QPL
Surface Mount
CQCC-44 (J-Lead)
QML V
Qualified
QPDSIS-38535
Surface Mount
CFP-16
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
TSSOP-16
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CFP-20
QML Q
Not qualified
QPDSIS-38535
Surface Mount
CFP-20
QML Q
Qualified
QPDSIS-38535
Surface Mount
CFP-20
Part validation activities
Cost & Activity Matrix