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Bond Pull Test for PIN Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for PIN Diodes
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
1858 results found for PIN/RF-Microwave Diode/Diode/Discretes
Part reference
Quality level / QPL
Package
Power Dissipation [Max]
TID (krads)
Forward Current [Max]
Total Capacitance [Max]
Unit price
Lead time
ESCC
Not qualified
ESCC QPL
Surface Mount
FP-4
400mA
JANS EQ
Not qualified
NOT LISTED IN QPL
Point to Point Wiring
Ministud C
JANTX EQ
Not qualified
NOT LISTED IN QPL
Point to Point Wiring
Ministud C
ESCC C
Not qualified
ESCC QPL
Not Available
Not Available
1,5W
200mA
0,38pF
ESCC C
Not qualified
ESCC QPL
Not Available
Not Available
4,1W
TID (HDR): 50.0
200mA
0,6pF
HIGH RELIABILITY
Not qualified
NOT LISTED IN QPL
Through Hole Mount
Axial
ESCC
Qualified
ESCC QPL
Surface Mount
M208a
0,5W
150mA
0,3pF
ESCC
Qualified
ESCC QPL
Surface Mount
M208c
0,5W
150mA
0,36pF
ESCC
Qualified
ESCC QPL
Surface Mount
M208a