


Cross Sectioning for Other Sensors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Other Sensors
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
9 results found for Other Sensors/IC Sensors/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
EP
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
CBGA-32
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
HSOIC-20
COMMERCIAL
Not qualified
NOT LISTED IN QPL
EVALUATED
Not Available
Not Available
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-14
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-14
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-20
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-14
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
PLGA-14
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
VQFN-36
Part validation activities
Cost & Activity Matrix