Servicio Familia 
Bond Pull Test for Other Sensors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
Bond Pull Test for Other Sensors
Bond Pull test evaluates bond strength distributions and determines compliance with the specified bond strength requirements of the applicable procurement document. Bond Pull test is applied to the wire-to-die bond, wire-to-substrate bond, or the wire-to-package lead bond inside the package of wire-connected devices bonded by soldering, thermo-compression, ultrasonic, or related techniques. >> Read more
EEE Parts Results Page
9 results found for Other Sensors/IC Sensors/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
EP
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
CBGA-32
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-14
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
HSOIC-20
COMMERCIAL
Not qualified
NOT LISTED IN QPL
EVALUATED
Not Available
Not Available
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
CQLCC-14
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CDIP-14
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
PLGA-14
EP
Not qualified
NOT LISTED IN QPL
Surface Mount
VQFN-36
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-20
Part validation activities
Cost & Activity Matrix