


Cross Sectioning for Other Power Drivers
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
Cross Sectioning for Other Power Drivers
The cross-sectioning process provides access to the device internal structure, its materials and design. Electronics components are often subjected to cross-sectioning to detect the defects that could not be found using other testing techniques. Cross-sectioning typically involves three discrete steps: mounting the sample in a block of epoxy resin to form the specimen, grinding or cutting the specimen and finally polishing the exposed surface. >> Read more
EEE Parts Results Page
55 results found for Other Drivers/Driver/Power Management/Microcircuits
Part reference
Quality level / QPL
Package
TID (krads)
SEE (MeV/mg/cm2)
Unit price
Lead time
COMMERCIAL
Not qualified
NOT LISTED IN QPL
SILVER
Surface Mount
TSSOP-28
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CAN-10
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQLCC-44
QML Q
Qualified
QPDSIS-38535
Surface Mount
CQCC-44 (J-Lead)
QML H
Qualified
QPDSIS-38534
Through Hole Mount
CAN-10
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-40
QML Q
Qualified
QPDSIS-38535
Through Hole Mount
CDIP-8
883
Not qualified
QPDSIS-38535
Through Hole Mount
CDIP-14
SPACE
Qualified
JAXA QPL
Surface Mount
CFP-68
TID (HDR): 100.0
QML H
Not qualified
QPDSIS-38534
Through Hole Mount
CAN-10
Part validation activities
Cost & Activity Matrix